Hamamatsu Photonics plans to construct a state-of-the-art factory at its manufacturing site in Ichino-cho, Higashi-ku, Hamamatsu City. With an estimated cost of $260 million, the new facility aims to enhance the company's pre-processing stage production capacity. The groundbreaking ceremony is scheduled for Friday, June 30, 2023, and the construction is expected to be completed by June 2025. By nearly doubling the company's production space, this factory will significantly contribute to its expansion.
In addition to the existing production lines for conventional 6-inch silicon wafers, Hamamatsu will operate a new production line within the new factory building. This production line will be capable of handling 8-inch diameter wafers, ensuring uninterrupted production while optimizing efficiency and reducing costs. To facilitate smooth operations, there will be a clean passage connecting the clean room of the new factory to the clean room of the existing building. This connection will enable efficient movement of personnel and materials, as well as automated manufacturing processes.
The new factory building incorporates earthquake-resistant structures to improve resilience against natural disasters. Furthermore, it will feature eco-friendly manufacturing equipment, aligning with the company's commitment to sustainable practices. Additionally, Hamamatsu Photonics is constructing another new factory building at its Shingai Factory site in Shingai-cho, Minami-ku, Hamamatsu City. This new facility will be dedicated to the device post-processing stage.
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